Cloud Musings
OCTOBER 21, 2014
3D Printing - Worldwide shipments of 3D printers are expected to grow 98 percent in 2015, followed by a doubling of unit shipments in 2016. 3D printing will reach a tipping point over the next three years as the market for relatively low-cost 3D printing devices continues to grow rapidly and industrial use expands significantly.
Storage IO Blog
JULY 31, 2015
3D XPoint is not NAND flash, it is also not NVRAM or DRAM, it’s a new class of NVM that can be used for server class main memory with persistency, or as persistent data storage among other uses (cell phones, automobiles, appliances and other electronics).
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Storage IO Blog
JULY 31, 2015
In a webcast the other day, Intel and Micron announced new 3D XPoint non-volatile memory (NVM) that can be used for both primary main memory (e.g. In a webcast the other day, Intel and Micron announced new 3D XPoint non-volatile memory (NVM) that can be used for both primary main memory (e.g.
Galido
AUGUST 26, 2016
About eighty percent of the data in your enterprise is in a multi-structured format, and that means it’s not in a relational format and is hard to analyze. Big data implies different analytics, different data structures, and diversity to the analytics that we need to deliver. Big data challenges and characteristics.
Galido
JULY 11, 2016
About eighty percent the data in your enterprise is in a multi-structured format, and that means it’s not in a relational format and is hard to analyze. Big data implies different analytics, different data structures, a diversity to the analytics that we need to deliver. Big data challenges and characteristics.
Storage IO Blog
APRIL 21, 2019
Driving ROI with Cloud Storage Consolidation Seminars Driving ROI with Cloud Storage Consolidation Seminars Join me in a series of in-person seminars driving ROI with cloud storage consolidation for unstructured file data. The post Driving ROI with Cloud Storage Consolidation Seminars appeared first on StorageIOblog.
Storage IO Blog
JULY 31, 2015
The initial die or basic chip building block 3D XPoint implementation is a layer 128 Gbit device which if using 8 bits would yield 16GB raw. For example while a current die could hold up to 16 GBytes of data, multiple dies could be packaged together to create a 32GB, 64GB, 128GB etc. or larger actual product.
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