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How 3D XPoint promises to reshape the data center

Tech Republic Data Center

The physical constraints and cost of DRAM have limited data center design for decades. However, 3D XPoint may hold the key to unleashing a new level of data center efficiency.

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Future Facilities and Partner to Productize ACE Data Center Metric

Data Center Knowledge

DCIM Solutions to build 3D data center models for clients and measure them against the three ACE dimensions Read More. Management Services'

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AMD stacks memory cache in 3D to boost datacenter CPUs

Venture Beast

Advanced Micro Devices is announcing it is shipping its third-generation AMD Epyc processors with AMD 3D V-Cache. Read More.

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AMD introduces third-gen Epyc Milan-X server CPUs with up to 768MB of L3 cache

TechSpot

AMD at Computex earlier this year teased next-gen 3D chiplet technology it developed in collaboration with Taiwan Semiconductor Manufacturing Company. During the company’s virtual Accelerated Data Center Premiere event on Monday, AMD announced it would be bringing this new technology to the data center.

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Emerson Adds Data Center Cooling Management in 3D

Data Center Knowledge

Latest release of Trellis DCIM software suite features device-level visualizations of thermal conditions Read More.

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Micron starts shipping its 176-Layer QLC SSD, available in a tiny form factor with 2TB of storage

TechSpot

It was back in November 2020 that Micron first started shipping the world’s first 176-layer 3D NAND flash memory. The company said it expected the technology to find its way into industries such as autonomous vehicles, in-car infotainment systems, and mobile storage, as well as client/data center SSDs.

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Intel Micron 3D XPoint Evolving

Storage IO Blog

Intel Micron 3D XPoint Evolving Intel Micron 3D XPoint Evolving Major memory classes or categories timeline (Image via Intel and Micron) Co-Creators of 3D XPoint the next generation of non-volatile memory (NVM) also known as storage class memory (SCM) or Persistent Memory (PMEM) have announced they will complete joint development of second-generation (..)

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