Intel, Micron: New 3D NAND Flash Triples Memory Capacity
Data Center Knowledge
APRIL 1, 2015
Intel Storage 3D NAND flash memory micron' Joint venture says new super-dense memory tech now generally available Read More.
Data Center Knowledge
APRIL 1, 2015
Intel Storage 3D NAND flash memory micron' Joint venture says new super-dense memory tech now generally available Read More.
Storage IO Blog
JULY 25, 2018
Intel Micron 3D XPoint Evolving Intel Micron 3D XPoint Evolving Major memory classes or categories timeline (Image via Intel and Micron) Co-Creators of 3D XPoint the next generation of non-volatile memory (NVM) also known as storage class memory (SCM) or Persistent Memory (PMEM) have announced they will complete joint development of second-generation (..)
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TechSpot
MAY 12, 2020
Intel is seemingly on track with its memory and storage product roadmap as it looks forward to launching the 144-layer 3D NAND QLC flash storage - codenamed Keystone Harbor - later this year. While the new denser 4th-gen modules would initially be available across limited capacities, the company is planning.
Storage IO Blog
JULY 31, 2015
In a webcast the other day, Intel and Micron announced new 3D XPoint non-volatile memory (NVM) that can be used for both primary main memory (e.g. In a webcast the other day, Intel and Micron announced new 3D XPoint non-volatile memory (NVM) that can be used for both primary main memory (e.g.
Storage IO Blog
JULY 31, 2015
3D XPoint is not NAND flash, it is also not NVRAM or DRAM, it’s a new class of NVM that can be used for server class main memory with persistency, or as persistent data storage among other uses (cell phones, automobiles, appliances and other electronics).
The Verge
DECEMBER 15, 2021
Intel made its first statement on the metaverse on Tuesday — its first public acknowledgement of that sometimes-nebulous future of computing which promises an always connected virtual world that exists in parallel with our physical one. Of course, Intel also has a vested interest in saying that we need more and better computers and servers.
Storage IO Blog
JULY 31, 2015
The initial die or basic chip building block 3D XPoint implementation is a layer 128 Gbit device which if using 8 bits would yield 16GB raw. Over time increased densities should become available as the bit density improves with more cells and further scaling of the technology, combined with packaging. or larger actual product.
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