TSMC and industry partners form 3DFabric Alliance focused on advancing chiplet architectures
TechSpot
OCTOBER 29, 2022
The 3DFabric Alliance applies the combined expertise of multiple industry partners to create and refine chiplet-based design and packaging technologies. The 19-member alliance, which is expected to expand, spans the entire product ecosystem and includes partners specializing in design, automation, memory, substrate, test, and other areas of the manufacturing process.
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