GeekWire
JUNE 15, 2024
My idea of weekend fun is browsing the racks at Seattle-area thrift stores in search of once-prized tech swag that has become castoff apparel, as a barometer of the status of the companies and brands emblazoned thereon. Seriously, I love to do this. Here are my best finds from today’s visit to the Goodwill. EST. 2015, R.I.P. 2023 … I bought this one, $2.99 red tag.
TechSpot
JUNE 15, 2024
Recently, users have struggled with stability issues related to Intel's Core i9-14900K & 13900K CPUs. Those with the processors have noticed increased game crashing, leading numerous developers to issue support notices. Intel said it would investigate.
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GeekWire
JUNE 15, 2024
Steve Schmidt, Amazon chief security officer, speaks at AWS re:Inforce this week. (Amazon Photo) This week on the GeekWire Podcast: It was a big week for cybersecurity for Seattle’s cloud giants, albeit in very different ways for each. Microsoft President Brad Smith was in Washington, D.C., testifying before the U.S. House Homeland Security Committee about Microsoft’s security challenges — stay tuned for highlights at the end of the show.
TechSpot
JUNE 15, 2024
In a note to investors this week, Bank of America said, "Consider it a top AI pick." It wasn't talking about Nvidia, even though BofA considers Green Team the undisputed winner of the GPU wars. It was referring to Broadcom, which recently announced a 10-to-1 stock split and better-than-expected revenue.
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SecureWorld News
JUNE 15, 2024
The healthcare industry has had a rough time when it comes to cybersecurity. Over the last few years, the number of data breaches in the healthcare industry has gradually increased. Clearly, there’s still a lot of work to be done to improve cybersecurity measures in healthcare. While every industry holds a wealth of sensitive information, the healthcare industry is particularly vulnerable because it deals with highly personal and confidential data.
TechSpot
JUNE 15, 2024
First up, Samsung took the wraps off two new process nodes aimed at pushing the limits of chip performance and efficiency. The headliner is the 2nm SF2Z process, slated for mass production in 2027. This one packs a clever trick with a backside power delivery network (BSPDN) that routes the.
Information Technology Zone brings together the best content for IT professionals from the widest variety of industry thought leaders.
TechSpot
JUNE 15, 2024
The December 2022 patent describes a GPU design split across multiple GPU chiplet sets. Each chiplet has a frontend die paired with several other shader-engine dies. The clever part is that these GPU chiplets can flexibly combine in various configurations.
TechSpot
JUNE 15, 2024
This minuscule chip packs 256GB of storage into a single die using WD's cutting-edge 8th-generation BiCS 3D NAND tech developed jointly with partner Kioxia. The manufacturing technology enables WD to fit 218 layers in a single die, almost twice the 112 layers most NAND flash memory today comes with. By.
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