AMD introduces third-gen Epyc Milan-X server CPUs with up to 768MB of L3 cache
TechSpot
NOVEMBER 8, 2021
AMD at Computex earlier this year teased next-gen 3D chiplet technology it developed in collaboration with Taiwan Semiconductor Manufacturing Company. During the company’s virtual Accelerated Data Center Premiere event on Monday, AMD announced it would be bringing this new technology to the data center.
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