3D Architecture Network Tools 
Storage IO Blog
JULY 25, 2018
Intel Micron 3D XPoint Evolving Intel Micron 3D XPoint Evolving Major memory classes or categories timeline (Image via Intel and Micron) Co-Creators of 3D XPoint the next generation of non-volatile memory (NVM) also known as storage class memory (SCM) or Persistent Memory (PMEM) have announced they will complete joint development of second-generation (..)
Storage IO Blog
AUGUST 21, 2018
Dell EMC PowerEdge MX 7000 Kinetic Based Data Infrastructure Architecture Dell EMC today announced with a tag line IT Unbound their new PowerEdge MX 7000 Kinetic Based Data Infrastructure Architecture slated for general availability September 21, 2018.
This site is protected by reCAPTCHA and the Google Privacy Policy and Terms of Service apply.
Dataconomy
MARCH 19, 2024
The next-gen AI supercomputer DGX SuperPOD is unveiled, featuring GB200 Grace Blackwell Superchips and liquid-cooled rack-scale architecture. The X800 series networking switches are introduced , boasting unparalleled end-to-end 800Gb/s throughput and advanced networking solutions for AI infrastructures.
Storage IO Blog
JULY 31, 2015
3D XPoint is not NAND flash, it is also not NVRAM or DRAM, it’s a new class of NVM that can be used for server class main memory with persistency, or as persistent data storage among other uses (cell phones, automobiles, appliances and other electronics).
Storage IO Blog
JULY 31, 2015
In a webcast the other day, Intel and Micron announced new 3D XPoint non-volatile memory (NVM) that can be used for both primary main memory (e.g. In a webcast the other day, Intel and Micron announced new 3D XPoint non-volatile memory (NVM) that can be used for both primary main memory (e.g.
CIO Business Intelligence
JUNE 13, 2023
The IT department has a big role in this debate as it tests and deploys the second and third generation of collaboration tools. Basic video chatting is being replaced by more purpose-built tools for enabling standup meetings, casual discussions, and full-blown multi-day conferences. The debate is not just technical.
Storage IO Blog
JULY 31, 2015
The initial die or basic chip building block 3D XPoint implementation is a layer 128 Gbit device which if using 8 bits would yield 16GB raw. Over time increased densities should become available as the bit density improves with more cells and further scaling of the technology, combined with packaging. or larger actual product.
Expert insights. Personalized for you.
41 
Let's personalize your content